WELLS ELECTRONIC TECHNOLOGY LTD

PCB Production

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Principle Products

        ·Express PCB
        ·Multilayer PCB(2-30 Layer)
        ·High Frequency Board
        ·Flexible Printing Board
        ·Blind/Buried Hole Board
        ·High Tg Thick Copper PCB
      ·Metal Core Board
      ·Metal Base Board(AI、Cu、Fe)
        ·Mix-Material Multilayer PCB
        ·Flat Winding Multilayer PCB
        ·Embedding Resistance/Capacitance Board
        ·Flexi-rigid Printed Board
        ·Halogen-ree/Lead-free Board
        ·Thick Gold Plating/Immersion Gold Board

Capacity

·Double Side 60000M2/Year
·Multilayer 50000M2/Year

Factory Area

·3000M2

Number of Employees

·516Person

Base Material

        ·Epoxy Fiber Glass Laminate FR4
        ·High Frequency  PTFE Base Material Supply By
         Rogers、Taconic etc.
        ·Aluminum Base Copper Clad Material Supply By
         Bergquist etc.

Soldermask

·Liquid Photo Imageable S/M

Plating Finishes

        ·Hot Air Leveling
        ·Flash Gold
        ·Gold Finger
        ·Electroless Gold Plating
        ·OSP
        ·HAL
        ·Lead free HAL

生产能力：
国内规模最大的样板小批量板快件制造之一，涵盖HDI、刚挠板等高新技术产品生产，提供小批量快速加工服务。

刚性板工艺能力
层数：2-40
最小线宽/间距：2 mil
最大板厚孔径比：16:1
表面处理工艺：热风整平、化学沉金、沉锡、沉银、全板镀金、金手指、有机涂覆处理、无铅热风整平
板厚：0.005″～0.276″（0.13mm~7.0mm）
材料：FR-4、高TG FR4、无卤素板、Rogers、Arlon、PTFE、Taconic、Isola等
最大板尺寸：23″* 35″(584mm*889mm)

刚挠板工艺能力
具备高密度刚挠板产品的批量规模生产能力
最高层数：20
最小线宽线距：3/3mil
最大加工尺寸：10*18inch
阻抗控制技术
HDI技术