| Consultation |
zyl508805 |
wells-electronic |
niazhang00 |
gaogw2008 |
|
Item |
Technical Parameters |
Specification | |||
|
Min. Line Width (mil) |
3 |
Finished product Copper thickness 0.5 OZ | |||
|
Min. Space (mil) |
3 |
Finished product Copper thickness 0.5 OZ | |||
|
Min. Annular Ring Width (mil) |
VIAS: 3mils |
Remained ring width means the distance between the
hole edge | |||
|
Component Holes : 5mils | |||||
|
Min. Hole Size |
Board Thickness< 2.0mm |
0.2mm |
Finished product | ||
| Board Thickness< 1.2mm | 0.1mm | Finished product | |||
|
Board Thickness ≥ 2.0mm |
Aspect Ratio ≤ 10 |
Finished product | |||
|
Max. Board Thickness |
Single and Double Side |
8.0mm |
1 | ||
|
Multilayer |
8.0mm | ||||
|
Min. Board Thickness |
Single and Double Side |
0.2mm | |||
|
Multilayer |
4 layers: 0.4mm; 6 layers: 0.6mm; | ||||
|
Max. Board Size |
Single and Double Side |
609 x 609mm | |||
|
Multilayer |
550 x 810mm | ||||
|
Distance between |
Outline: 0.20mm | ||||
|
V-CUT: 0.4mm | |||||
|
Max. Layers |
30 layers | ||||
|
Solder |
Mask Window (mil) |
2/4 |
1. Single side; 2. 2mil is allowed for mask bridge or avoiding exposed lines. | ||
|
Mask Bridge (mil) |
6 |
Between IC pins | |||
|
Color |
White, Black, Blue, Green, Yellow, Red, etc. |
1 | |||
|
Legend |
Min. Line Width (mil) |
5/8 | |||
|
Color |
White, Yellow, Black, etc. | ||||
|
Surface Plating |
HAL, Plated Ni/Au, Immersion Ni/Au, etc. | ||||
|
Plating Thickness (microinch) |
Techniques |
Plating Type |
Min. Thickness |
Max. Thickness | |
|
Plated Ni/Au |
Ni Thickness |
100 |
150 | ||
|
Au Thickness |
1 |
3 | |||
|
Immersion Ni/Au |
Ni Thickness |
100 |
150 | ||
|
Au Thickness |
1 |
3 | |||
|
Gold Finger |
Ni Thickness |
120 |
150 | ||
|
Au Thickness |
5 |
30 | |||
|
Copper Plating Hole (micron) |
Copper Thickness |
20 |
25 | ||
|
Base Copper Thickness |
Inner layers and Outer layers (oz) |
0.5 |
6 | ||
|
Finished Copper Thickness |
Outer Layers |
1 |
6.5 | ||
|
Inner Layers |
0.5 |
6 | |||
|
Insulation Layer (mm) |
0.06 |
---- | |||
|
Line Width/Space (mil) |
Max. Copper Thickness | ||||
|
4/4; 4/5; |
0.5 oz |
Line width shouldn’t be less than the required value under ensure of space. | |||
|
4/6; 5/5; 6/5 |
1 oz | ||||
|
5/6; 6/6 |
2 oz | ||||
|
6/8; 7/8; 8/8 |
3 oz | ||||
|
8/10; 9/10; 10/10 |
5 oz | ||||
|
Board Materials |
FR-4; Aluminium Base; High Frequency; PTFE; FPC; Thick Copper; Paper Base; BT Base; Pi Base; Rogers4003 (PPC: 4403); PTFE+Al |
1 | |||
|
Board Outline
Tolerance:
|
Finished Product Thickness Tolerance: |
生产能力:
国内规模最大的样板小批量板快件制造之一,涵盖HDI、刚挠板等高新技术产品生产,提供小批量快速加工服务。
刚性板工艺能力
层数:2-40
最小线宽/间距:2 mil
最大板厚孔径比:16:1
表面处理工艺:热风整平、化学沉金、沉锡、沉银、全板镀金、金手指、有机涂覆处理、无铅热风整平
板厚:0.005″~0.276″(0.13mm~7.0mm)
材料:FR-4、高TG FR4、无卤素板、Rogers、Arlon、PTFE、Taconic、Isola等
最大板尺寸:23″* 35″(584mm*889mm)
刚挠板工艺能力
具备高密度刚挠板产品的批量规模生产能力
最高层数:20
最小线宽线距:3/3mil
最大加工尺寸:10*18inch
阻抗控制技术
HDI技术