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Equipment & Technical

 

 

 

 

 

Process Management

Location:Home >> Equipment & Technical >> SMT Production

Process                                                                                                              Quality Management

Screen Printing

SMT

PCB baking, solder paste management, copperplate management, solder paste thickness/quality measurement

Components Mounting

Equipment inspection/maintain, process inspection, parameter setting, balance rate, NG prevention

Air Reflow

PROFILE curve, timing measurement, 3D visual inspection

Inspection & Touch-up

Visual inspection, timing temperature test, quality report, problem feedback, correction

ICT Test

Quality report, maintain, problem feedback and correction

PQC Sampling Inspection

Rework and sorting report, feedback, correction

Components Insertion

DIP

semi-manufactured goods baking, active inspection, SOP, ESD

Wave Soldering

Flux  specific gravity and distribution, warm-up temperature, solder stove temperature, SPF, parameter management 

Visual Inspection& Touch-up

Solder paste inspection, brand iron temperature observation, board cleaning

Function Test

Test jig management, test process management, test record tracking management, problem feedback

Final Inspection

Visual inspection Rework sorting

FQC Sampling Inspection

PA

Appearance inspection, electrical characteristies inspection

PACKIIN

Serial No. management, weight measure management, burglarproof packing strap

OQC

Packing way, appearance, function, battery


生产能力: 
国内规模最大的样板小批量板快件制造之一,涵盖HDI、刚挠板等高新技术产品生产,提供小批量快速加工服务。



刚性板工艺能力 
层数:2-40
最小线宽/间距:2 mil
最大板厚孔径比:16:1
表面处理工艺:热风整平、化学沉金、沉锡、沉银、全板镀金、金手指、有机涂覆处理、无铅热风整平
板厚:0.005″~0.276″(0.13mm~7.0mm)
材料:FR-4、高TG FR4、无卤素板、Rogers、Arlon、PTFE、Taconic、Isola等
最大板尺寸:23″* 35″(584mm*889mm)



刚挠板工艺能力
具备高密度刚挠板产品的批量规模生产能力
最高层数:20
最小线宽线距:3/3mil
最大加工尺寸:10*18inch
阻抗控制技术
HDI技术

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